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ELLIPTICAL FIN BGA HEATSINKS
These heatsinks were created to ease the thermal challenges design engineers face when working with newer BGA and other SMT packaged chipsets incorporating increased chip speed and power requirements. Large fins and lower pressure drop characteristics ensure optimal cooling performance.
FEATURES & BENEFITS
- Ideal for applications with swirling air environments or multiple heatsinks are used in a series (in a row)
- Low pressure drop characteristics provide superior cooling performance
- Attachment options include a plastic BGA clip for easy installation and removal, or Chometrics T710 interface pad
- No modifications or mounting accessories required
- Standard finish includes lightweight Aluminum 6063 with black anodized plating
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