BGA/QFN Adapt-A-Board® Prototyping Boards

FEATURES Mountable 0.50mm, 0.80mm, 1.00mm, 1.27mm pitch BGA/QFN up to 900 pins. Sockets available to mount adapter boards if needed. The BGA signals are all routed to test point holes on the outer edges for each connection to your mother board or test instrument. Each board will fit any chip package within the specified grid size and ball pitch. Customs available upon request

SPECIFICATIONS

PACKAGE:	0.50mm, 0.80mm, 1.00mm, 1.27mm Lead Pitch
MATERIAL SIZE:	Glass Epoxy (FR4 4 layers); 76.20mm x 76.20mm
BOARD THICKNESS:	1.60mm
COPPER PLATE:	Outside Layer 18mm; Inside Layer 35mm
TREATMENT:	Both Sides Thru Hole; Resist Gold flash plate
PIN NUMBER:	Top Side Silk Print; Pin Map Available
MAXIMUM CURRENT:	0.15A per line

ASSOCIATED LINK:

• BGA Screwlock SMT Socket (Attach a screw lock surface mount socket to your prototype board for easy/quick insertion and removal of chip packages without the solder/desolder process.

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