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IC Development Sockets
Development Sockets are high-performance sockets targeted to the R&D phase of IC or system design and development.
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Standard Process Development Sockets
Our "Standard Process Development Sockets" are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. These are available with 5, 7, 10 or 15-day expedited lead times, with a standard 5-week delivery. These sockets utilize our patented pin technology, providing a variety of mounting methods, 3GHz bandwidth, heatsink options, and a list of other features. These are available for any package size, pin/ball count and pitch down to 0.5mm. Please click here for ET's Development Socket Overview
Choose from five DUT retention styles:
Theses sockets are available in four PCB mounting styles:
- SMT: uses paste to reflow the socket to the same target footprint as the IC
- Raised SMT: uses paste to reflow the socket to the same target footprint as the IC, but uses longer pins to allow the socket body to clear adjacent components
- Compression Mount: bolts to the target PCB. Avoids the need to reflow the socket, but requires pre-existing tooling holes in the PCB
- Through-Hole
: through-hole pins reflow into holes in target PCB
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| SMT | Through-Hole | Compression |
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Custom Development Sockets
Our "Custom Development Sockets" are custom designed to meet your requirements. These sockets are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. They are available for any package size, pin/ball count and pitch down to 0.3mm. The socket's contact element is optimized for the application. Various contact elements are available: pogo-pin, elastomer, capped spring, PCB embedded contact, etc. Custom designs give a multitude of options, including higher bandwidths, lower contact forces, meeting z-height requirements, etc.
Custom Development Sockets
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FULL LINE CATALOG
