ET 3300
Elastomer
IC Development Sockets

The ET 3300 line is an elastomer based socket system that operates at up to 10 GHz bandwidth with –1dB of insertion loss.  This socket system allows the user to test or debug any BGA, QFN or other custom packages covering all lead pitches down to 0.1mm. 

Applications include development, debug, hand test, programming, test of ASIC or FPGA’s, package and chip qualification, production prototype, failure analysis and high volume production use. This socket system also gives engineers a method to test high-speed packaged semiconductors at an economical price.

HOW DOES IT WORK?

The ET 3300 has 3 target board mounting methods; compression mount, surface mount and thru-hole. The compression style mounts quickly and easily using four predefined tooling holes. The surface mount and thru-hole version both use a separate adapter that is solder mounted to the customer’s target printed circuit board. The socket is then mechanically secured to the adapter.

Two retention systems are available for this socket; Easy KnobTM, suited for high rates of insertion and Easy ScrewTM for applications where the chip package is changed infrequently during the project life.  A unique feature of this product is that the customer can buy both retention systems for the same socket and interchange in the lab as his needs change. The Easy ScrewTM retention system can be designed with an opening in the middle to accommodate die probing.

Features and Benefits

• Up to 10 GHz bandwidth
• 60,000 insertion cycles
• Built-in mechanical stop, prevents chip damage
• Compression mount to PCB
• Elastomeric contacts
• Accepts any pitch down to 0.1mm
• Package size up to 45mm x 45mm
• Accommodates BGA, LGA, QFN and custom packages
• Easy Screw & Easy Knob retention systems are
  interchangeable and sold together upon request
• Custom retention covers available
• Rush delivery – 5, 7, 10 and 15 day
• Easy assembly

ADDITIONAL INFORMATION

• Data Sheet

Socket Examples